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Linked Electronics Co., Limited One Stop PCB solution Provider
6 Years
| Ask Lasest Price | |
| Brand Name : | Linked Electronics |
| Model Number : | LPCB1430 |
| Certification : | UL, TS16949, ISO14001, ISO9001 |
| Price : | by negotiation |
| Payment Terms : | T/T, Western Union,Paypal |
| Supply Ability : | 10, 000pcs per month |
| Delivery Time : | 4 weeks |
HDI Electronic Black PCB with Controlled Impedance Multilayer Circuit Board Fabrication
Linked Electronics Co., Limited was founded in 1998. Our main service is the production of multi-layer, double and singlesided printed circuit boards, especially for the high mixed, low volume PCB and PCBA fabrication services. We have emphasized quality and speed of processing an order since the foundation of Linked PCB.
Since the opening our factory, we have invested great money into new instruments, which have noticeably improved the quality of our products and have opened us the path even to the most demanding customers.
One Stop PCB Services that Linked Electronic Provides
1.PCB fabrication, this includes a wide range of Electronic PRINTED CIRCUIT BOARDS, such as FR4 Rigid PCB, Flex PCB, Rigid-Flex PCB, Aluminium PCB, Rogers PCB and so on
2.PCB PROTOTYPING – No MOQ for our PCBs, you can order even 1pcs –
EXPRESS TIMES
SMALL, MEDIUM, AND LARGE VOLUME PCB PRODUCTION.
3.PCB ASSEMBLY with components sourcing as well as final functionality testing.
4. LASER CUT STENCILS with various specifications.
5. QUALITY GUARANTEE Policy– 100% TESTING AND INSPECTION before shipping– testing and parameter measuring of printed circuit boards produced, including assembled boards (cross sectional examination of boards with components), utilizing non-destructive methods (electrical measurements or X-ray inspections) as well as destructive methods for bare PCB Board (metallographic cross-sectioning, thermal stress testing, solderability testing, and so on).
PCB Product HDI Electronic Black PCB with Controlled Impedance Multilayer Circuit Board Fabrication
PCB Manufacturing Capabilties at Linked Electronics
| Layers | Mass production: 2~32 layers / Proto run: 64 layers |
| Max. Thickness | Mass production: 394mil (10mm) / Proto run: 17.5mm |
| Material | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc. |
| Min. Width/Spacing | Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) |
| Max. Copper Thickness | UL certificated: 6.0 OZ / Proto run: 20OZ |
| Min. Hole Size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| Max. Panel Size | 1150mm × 560mm |
| Aspect Ratio | 12:1 |
| Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
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